ADT6501/ADT6502/ADT6503/ADT6504
Data Sheet
Rev. B | Page 4 of 16
ABSOLUTE MAXIMUM RATINGS
Table 2.
Parameter
Rating
V to GND
0.3 V to +7 V
HYST In ut Volta e to GND
0.3 V to V + 0.3 V
Open-Drain Output Voltage to GND
0.3 V to +7 V
Push-Pull Output Voltage to GND
0.3 V to V + 0.3 V
Input Current on All Pins
20 mA
Output Current on All Pins
20 mA
O eratin Tem erature Ran e
55癈 to +125癈
Storage Temperature Range
65癈 to +160癈
Maximum Junction Temperature, T 150.7癈
5-Lead SOT-23 (RJ-5)
Power Dissipation
1
W
MAX
= (T
MAX
T
A
2
)/?/DIV>
A
Thermal Impedance
3
?nbsp Junction-to-Ambient Still Air 240癈/W
IR Reflow Soldering
(RoHS Compliant Package)
Peak Temperature
260癈 (+0癈)
Time at Peak Temperature
20 sec to 40 sec
Ramp-Up Rate
3癈/sec maximum
Ram -Down Rate
6癈/sec maximum
Time 25癈 to Peak Temperature
8 minute maximum
1
Values relate to package being used on a standard 2-layer PCB. This gives a
worst case ?/DIV>
JA
. Refer to Figure 2 for a plot of maximum power dissipation vs.
ambient temperature (T
A
).
2
T
A
= ambient temperature.
3
Junction-to-case resistance is applicable to components featuring a
preferential flow direction, for example, components mounted on a
heat sink. Junction-to-ambient resistance is more useful for air-cooled,
PCB-mounted components.
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
Figure 2. SOT-23 Maximum Power Dissipation vs. Temperature
ESD CAUTION
0.9
0
125
TEMPERATURE 癈
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
55
50
40
30
20
10
0
10
20
30
40
50
60
70
80
90
100
110
120
SOT-23 PD @ 125癈 = 0.107W
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